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A*STAR's Institute of Microelectronics (IME), Singapore and Chartered Semiconductor Manufacturing (Nasdaq: CHRT) and (SGX-ST:Chartered), one of the world's top dedicated semiconductor foundries, have successfully optimized a range of fine-pitch packaging technologies for copper metallization and low-k dielectri¡­

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¾ÝϤ£¬Ì¨»ýµç(Taiwan Semiconductor Manufacturing Co., )ÆìÏÂÒ»·çÏÕͶ×ʹ«Ë¾ÈÕÇ°ÊÕ¹ºÖÇ°î¿Æ¼¼(Accton Technology Corp.,)½¨Á¢µÄÒ»¼Òϵͳ¼¶·â×°¹«Ë¾µÄ48%µÄ¹É·Ý¡£µ«½»Ò×½ð¶î²¢Î´Ã÷È·¡£ ¾Ý̨ÍåýÌ屨µ¼£¬Ì¨»ýµçÆìϵÄVenturetech Alliance Fund III L.P.ÓÚ7ÔºÍ8Ô½øÐÐÁË¡­

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Êг¡Ñо¿¹«Ë¾Global Industry Analysts Inc.³Æ£¬2007ÄêÈ«ÇòÏȽøµç×Ó·â×°Êг¡Îª282.7ÒÚÃÀÔª£¬Ô¤¼Æ2012Äê¸ÃÊг¡¿É´ï420ÒÚÃÀÔª¡£ÑÇÌ«Êг¡ÊÇ×î´óµÄÇøÓòÊг¡£¬Ô¤¼Æ2008ÄêÊÕÈë¿É´ï122ÒÚÃÀÔª¡£Ð¾Æ¬¼¶·â×°Êг¡ÊÕÈëÔÚ2000ÄêÖÁ2010Ä꽫»ñµÃ×î¿ìËÙÔö³¤£¬Äê¾ùÔö·ùΪ1¡­

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Replisaurus Technologies announced today that it has secured €7 Million in financing from Noble Venture Finance to prepare for the commercialization of its new, clean metallization technology for the chip packaging market. Considering the difficult current economic climate, this bold financial commitment shows that companies like ¡­

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½üÈÕ£¬AMD·â×°ºÍ»¥Áª¼¼ÊõÖ÷¹ÜNeil McLellanÔÚ½ÓÊÜýÌå²É·Ãʱ£¬Ï꾡·ÖÎöÁËGPU·â×°Öеļ¼Êõ²îÒ죬ÒÔ¼°NVIDIAÒƶ¯GPU½üÆÚ³öÏÖ·â×°ÎÊÌâµÄÔ­Òò¡£¸ù¾ÝËûµÄ·ÖÎö£¬NVIDIAÔÚGPU·â×°ÖÐʹÓõĸßǦ͹µãÊÇ×î´óµÄ»ö¸ù£¬¶øAMDÔçÒÑ»»Óøü¼Ó¿É¿¿µÄµÍÈÛµãÎý¡­

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Ä¿Ç°£¬°ëµ¼Ìå·ÖÁ¢Æ÷¼þ»¹Ã»ÓÐÏíÊܵ½Ïñ¼¯³Éµç·²úÒµÄÇÑùµÄÓÅ»ÝÕþ²ß£¬²»ÀûÓÚ·ÖÁ¢Æ÷¼þ³ÖÐø·¢Õ¹¡£Öйú·ÖÁ¢Æ÷¼þÆóÒµÒª¼á³ÖÔÚ¿Æѧ·¢Õ¹ÖÐÑ°ÕÒ½â¾öÀ§ÄѵÄ;¾¶£¬ÒÔ»ý¼«µÄ×Ë̬ӭ½ÓÖйú°ëµ¼ÌåÃÀºÃµÄÃ÷Ìì¡£ ¾¡¹Ü¼¯³Éµç·µÄ·¢Õ¹Ê¹Ò»Ð©Æ÷¼þÒѼ¯³É½ø¼¯³Éµç·£¬µ«¡­

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Ä¿Ç°£¬°ëµ¼Ìå·ÖÁ¢Æ÷¼þ»¹Ã»ÓÐÏíÊܵ½Ïñ¼¯³Éµç·²úÒµÄÇÑùµÄÓÅ»ÝÕþ²ß£¬²»ÀûÓÚ·ÖÁ¢Æ÷¼þ³ÖÐø·¢Õ¹¡£Öйú·ÖÁ¢Æ÷¼þÆóÒµÒª¼á³ÖÔÚ¿Æѧ·¢Õ¹ÖÐÑ°ÕÒ½â¾öÀ§ÄѵÄ;¾¶£¬ÒÔ»ý¼«µÄ×Ë̬ӭ½ÓÖйú°ëµ¼ÌåÃÀºÃµÄÃ÷Ìì¡£ ¾¡¹Ü¼¯³Éµç·µÄ·¢Õ¹Ê¹Ò»Ð©Æ÷¼þÒѼ¯³É½ø¼¯³Éµç·£¬µ«¡­

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¸ù¾ÝÊг¡µ÷Ñй«Ë¾TechSearch International Inc. (Austin, Texas)×îеı¨¸æ£¬´Ó2007Äêµ½2012Ä꣬µ¹×°Ð¾Æ¬£¨Flip-chip£©ºÍ¾§Ô²¼¶·â×°£¨ WLP £©½«ÒÔ14%µÄÄêÔöËÙÎȲ½Ç°½ø¡£TechSearch International forecasts steady 14% annual growth rates for flip-chip packaging. (Source: STATS ChipPAC¡­

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Íâ×ÊÆóÒµËäÔÚÖйúIC·â×°²âÊÔÁìÓòÕ¼¾ÝÁ˾ø¶ÔÓÅÊÆ£¬µ«ÄÚ×Ê·â×°²âÊÔÆóÒµÅ·¢Õ¹£¬ÖÐСÆóÒµ²»¶ÏÓ¿ÏÖ£¬ÄÚ×ÊÌرðÊÇÃñÓªÆóÒµµÄ·¢Õ¹ÎªIC·â×°²âÊÔÒµÔöÌíÁË»îÁ¦ºÍÏ£Íû¡£ ÔÚÈ«Çò¾­¼ÃÔöËÙ·Å»ºµÄ´ó±³¾°Ï£¬°ëµ¼ÌåÊг¡ÐèÇó·¦Á¦£¬¹úÄÚ¼¯³Éµç·²úÒµµÄÔö·ùÒ²Ã÷ÏÔ¡­

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¶÷ÖÇÆÖ°ëµ¼Ì壨NXP Semiconductors£¬ÓÉ·ÉÀûÆÖ´´½¨µÄ¶ÀÁ¢°ëµ¼Ì幫˾£©½üÈÕÐû²¼ÍƳöÈ«ÐÂFlatPower·â×°µÄMEGA SchottkyÕûÁ÷Æ÷£¬°üÀ¨SOD123WºÍSOD128¡£ÒòΪ¡°½ðÊô°å°ó¶¨¡±µÄ·â×°³É¹û£¬ÐµÄMEGA²úÆ·´øÀ´¿ÉæÇÃÀ±ê×¼SMA·â×°µÄ¸ß¹¦ÂÊÐÔÄÜ¡£Ð²úÆ·ÒÔÆä׿¡­

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