FLANDERS, NJ (January 22, 2008)—Rudolph Technologies, Inc. (NASDAQ-RTEC), a leading provider of process characterization equipment and software used in wafer processing and semiconductor final manufacturing (back-end) facilities, announced today that it has acquired all intellectual property and selected assets f…

http://article.sichinamag.comhttp://article.sichinamag.com/2008-01/2008123014944.htm -- 2008-1-23 0:00:00

Sonoscan has introduced the AW200™ Series C-SAM® acoustic micro imaging system, which performs automated inspection, analysis and sorting of bonded wafers up to 200mm (8 in.) in diameter. To avoid immersing the bonded wafer pair in water - a technique that can conceal defects - the AW200 images wafer pairs …

http://article.sichinamag.comhttp://article.sichinamag.com/2007-12/2007125022305.htm -- 2007-12-5 0:00:00