电浆蚀刻和沉积系统的领导设计与制造厂商Tegal Corporation今天宣布其已与Alcatel Micro Machining Systems (AMMS) 和Alcatel-Lucent签约，以并购针对进阶3D晶圆层级封装应用的深层反应性离子蚀刻(DRIE) 和电浆体增强化学气相沉积) (PECVD)产品线与相关智能财产权。
这笔价值500万美元的限制性股票与现金交易案，预计将于本月稍后完成。合约内容包括指派AMMS的总裁Gilbert Bellini担任Tegal公司董事。合约也要求AMMS持续支持由MEMS和整合式装置制造商已安装的DRIE工具。Tegal将持续进行AMMS DRIE 产品线的开发，包括AMMS 最近推出的Compact™桥接平台之制程模块整合，以及完成其300mm 制程腔体等。除此之外，Tegal也将承接AMMS与主要客户，以及研究与学术机构的共同研发计划。
「这对Tegal而言是一项重要的策略性决策。」Tegal的总裁暨执行长Thomas Mika表示，「.这些产品，加上我们既有的蚀刻与沉积技术，将构成一个全方位策略的基础，让我们可以积极追求在MEMS和半导体装置生产方面的大规模高成长市场。透过这笔交易案，相信我们将能够提供客户最先进的技术、最佳的顾客支持，以及已获实证的生产应用系统。」
「Tegal以提供全球MEMS和半导体装置制造商先进的制程与生产工具而闻名。」 AMMS总裁Gilbert Bellini表示，「本人非常荣幸能与Tegal合作，也非常高兴能够有机会担任该公司的董事，以确保近期内AMMS的业务移转到Tegal的过程能够顺利无虞，并且帮助 Tegal进入3D晶圆层级封装应用这个正在快速成长的市场。」
Tegal在这笔交易案成交之时，将支付AMMS 100万美元的现金和价值400万美元的Tegal新发行普通股股票。预计将新发行的股数将相当于400万美元除以Tegal普通股在并购案成交日期前五日的平均收盘价计算。交易完成时间将视成交条件惯例而定，但合约双方预计在2008年9月16日完成此交易案。
Tegal Corporation , a leading designer and manufacturer of plasma etch and deposition systems, today announced that it has signed an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their Deep Reactive Ion Etch (DRIE) and Plasma Enhanced Chemical Vapor Deposition (PECVD) products, and the related intellectual property, directed at advanced 3-dimensional wafer-level packaging applications.The restricted stock and cash deal, valued at US$5 million, is expected to close later this month. As part of the agreement, Gilbert Bellini, President of AMMS, will be appointed to Tegal’s Board of Directors.
The agreement calls for the continued support by AMMS of the existing installed base of DRIE tools in use by MEMS and integrated device manufacturers. Tegal will continue the development of the AMMS DRIE product line, including the integration of the AMMS process modules on its recently-introduced Compact™ bridge platform and the completion of a 300mm process chamber. In addition, Tegal will assume responsibility for AMMS’ joint development programs with key customers, as well as research and academic institutions.
“This is an important strategic move for Tegal,” said Thomas Mika, Chairman, President and CEO of Tegal. “These products, along with our current etch and deposition technologies, will form the basis for a comprehensive strategy to aggressively pursue a large, high growth market in MEMS and semiconductor device manufacturing. With this transaction, we believe that we can offer customers the best combination of leading-edge technology, customer support and proven systems for production applications.”
“Tegal is well-known for providing advanced processes and production tools to MEMS and semiconductor device manufacturers worldwide,” said Gilbert Bellini, President of AMMS. “I am proud to be associated with Tegal and pleased to work with the Company as a director to ensure the smooth transition of the AMMS business to Tegal inthe near-term and to help guide Tegal into the rapidly expanding markets for 3D wafer level packaging applications.”
At closing, Tegal will pay to AMMS US$1 million in cash and US$ 4 million worth of newly issued shares of Tegal common stock. The number of shares to be issued will be equal to US$4,000,000 divided by the average of the closing sales prices of Tegal common stock for the five (5) consecutive trading days immediately prior to the closing date of the Acquisition. Completion of the transaction is subject to customary closing conditions, but parties expect to close the transaction on or about September 16, 2008.
Tegal’s senior management will conduct a conference call today at 5:00 p.m. EDT / 2:00 p.m. PDT to discuss the agreement between Tegal and AMMS.