the sample need be moved to change laser frequency allows depth profiling at the precise point of interest was a very important consideration in the design of this tool”, noted Dr. Yoo.
The MRS-300 and its companion tool, the just announced OSP-300 (Optical Surface Profilometer), were designed by WaferMasters to give process engineers the tools they need to improve process repeatability and device yield through improved knowledge of the physical condition of the wafer as it goes through seque
ntial process steps.