efects.
Rudolph’s NSX macro defect
inspection system delivers exceptional value
for magnetic head manufacturing. Developed originally for back-end semiconductor processes,
the NSX System is able to deliver the same sensitivity
and throughput as Rudolph’s front-end inspection tools without the cost burden of cleanroom compatibility.
The MetaPULSE-II, which uses Rudolph’s patented picosecond ultrasonic laser sonar (PULSE®) Technology, is designed to provide accurate, low-noise measurements o
f the multilayer metal stacks used in head manufacturing. The VX3 probe card inspection tool is designed to provide critical information for testing and maintaining probe cards and optimizing the parameters of the probing process.