Akrion, Inc. ("Akrion"), a supplier of semiconductor surface preparation equipment, closed 2007 by shipping another Velocity(TM) single-wafer cleaning system to a major LOGICdevice manufacturer in Asia.
The Velocity system will be used for an advanced pre-photolithographycleaning application on a copper (Cu) 65nm device process line. Akrion'sproprietary megasonic cleaning technology enhances the system's ability toremove the backside particles that can build up on the lithog
raphy stage
and cause pattern misprints.
Akrion has numerous patents concerning the use of megasonics. Thesystem shipped combines Goldfinger(R) front-side megasonics and Akrion'slatest back- side megasonics to provide concurrent front-side and back-sidecleaning in one step, in one tool.
James S. Molinaro, Akrion President and CEO said, "Velocity's abilityto clean the front and back of the wafer simultaneously speeds processingand reduces capital outlay. It has shown itself to be especially adept inreducing photolithography re-work to enhance productivity."