FLandERS, NJ (January 22, 2008)—Rudolph Technologies, inc. (NASDAQ-RTEC), a leading provider of process characterization equipment and software used in wafer processing and semiconductor final manufacturing (back-end) facilities, announced today that it has acquired all intellectual property and selected assets from privately-held RVSI Inspection, headquartered in Hauppauge, New York. the addition of RVSI’s industry-standard WS-3800 3D bumped wafer inspection system to its product portfolio is
expected to strengthen Rudolph’s established presence in the high-growth, advanced packaging market.
“We are pleased to announce the close of this transaction,” said Paul F. McLaughlin, chairman and chief executive officer of Rudolph. “This purchase, as well as our recently-announced acquisition of Applied Precision’s probe card test and analysis business, was orchestrated to enhance our position as a dominant supplier of inspection and metrology solutions for an increasing number of back-end applications.”
“The RVSI WS-3800 tool is the perfect complement to the Rudolph NSX® 2D macro defect inspection system, which is the workhorse tool-of-choice deployed in most of the leading fabs around the world,” McLaughlin continued. “We believe these high-performance systems will give our customers a comprehensive solution for both 2D and 3D inspection.”
“We will be adding an excellent technical team to our Rudolph organization, and expect to quickly and efficiently fold the RVSI operations into our existing inspection business,” said Nathan Little, executive vice president and general manager of the Inspection Business Unit. “With a high level of customer overlap, combined with our existing global applications and service support network, our goal is to make this transition as seamless as possible.”
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