Sonoscan has introduced the AW200™ Series C-SAM® acoustic micro imaging system, which performs automated inspection, analysis and sorting of bonded wafers up to 200mm (8 in.) in diameter.
To avoid immersing the bonded wafer pair in water - a technique that can conceal defects - the AW200 images wafer pairs with Sonoscan’s proprietary Waterfall™ transducer. After imaging, the wafer pair is automatically dried.
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nbsp; The AW200 employs Sonoscan-designed very high frequency transducers capable of detecting inter-wafer voids as small as 5 microns in diameter and as thin as 0.02 micron (0.0000008 in.). The transducers scan the wafer at the same high speed as other C-SAM instruments thereby providing the highest scanning throughput in the industry. The two high-precision robotic arms that handle the wafer pairs permit even higher throughput.
Automated analysis of the acoustic data accurately determines the bonded/non-bonded areas, the number and sizes of voids, zero level package seal integrity, and the accept/reject status of the wafer pair according to the user’s criteria.
