EV Group (EVG, St. Florian, Austria) said an Austrian semiconductor manufacturer has installed an EVG850TB temporary bonding system for high-volume processing of thin device wafers.
The company, which supplies wafer bonding and thin-wafer processing equipment for MEMS devices, said the need to reduce device power consumption is driving the need for thinner wafers, requiring special processing techniques, including temporary bonding of wafers to a carrier substrate and debonding of wafers follo
wing backgrinding and other processing steps.
The EVG850TB’s bonding system enables thin-wafer processing capabilities, including automatic processing of ultrathin substrates of <100 µm on various wafer sizes. The task is made more complex, according to the company, by increased diameter variations, handling sensitivity and reduced wafer-edge quality from back grinding, substrate warping and fragile materials. “All of this requires a specialized know-how to create an automated system platform,” said Stefan Pargfrieder, business development manager.
He said the EVG system is the first to align and center the carrier wafers, device wafers and dry laminated adhesive tape on an automated cluster platform. The system handles various substrate diameters, and integrates pre-processing and post-processing steps, such as coating, protective film removal and cleaning, he added.