Batch Spray Processing for Superior Photoresist Stripping and Film Removal
喷雾清洗平台优化光阻剥离和薄膜去除工艺
Jame Chu,Field Applications Engineering Manager for Southeast Asia and Greater China,FSI-International
随着制程的细微化前进到65nm及更高节点，在晶圆的蚀刻清洗方面，如何满足客户在技术与制程的支持、制造成本和产品质量的要求也是重要的课题。FSI喷雾清洗平台——ZETA系统清洗解决方案在减少表面损害、材料损失、制造周期时间和资金投入的帮助。随着已注入光刻胶的应用不断上升，可允许的材料损失和表面损坏水平程度不断下降，以及不断提升的制造效率需求，IC制造过程中的光刻胶去除已经成为业界的挑战。
Speaker Bio.:
James Chu (Ming Mao), FSI International field applications engineering manager for Sou
theast Asia and Greater China, received his masters degree in Engineering Science from the National Cheng Kong University at Tainan, Taiwan. Prior to joining FSI, he was responsible for introducing new lithography technology to Asia for 90nm, 65nm and 45nm semiconductor fabrication process development with ASML Lithography. He is a member of SPIE and has done numerous papers and presentions on nano fabrication technology. In addition, Chu has 10 years project management experience in field application of advanced weaponary systems. Currently he is also pursuing his PhD with research emphasis in metrological interpretation of nano scale phenomenon for microelectronics.
Abstract:
Batch spray processing has demonstrated superior performance for photoresist stripping and other film removal applications for 65nm and below technology generations. As a result of successful joint development projects, the FSI ZETA® System is qualified and in production for stripping photoresist following high-dosage plasma immersion implantation and also for stripping Ni and NiPt films after salicide formation. Polysilicon loss is reduced by 50% and dopant loss is reduced by 40% after plasma immersion implantation using the FSI ZETA® System single-step all-wet process instead of a standard three-step wet+ash+wet process. For salicide formation, excellent residue removal and superior electrical results are achieved using the FSI ZETA® System with efficient fresh chemical dispense.
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