Rudolph Technologies, Inc. (NASDAQ: RTEC), the leading provider of process characterization systems for the semiconductor manufacturing industry, will showcase the AXi™ 935 Advanced Macro Defect inspection System during SEMICON® Taiwan, taking place September 12-14, 2007 at the Taipei World Trade Center in Taipei, Taiwan.
“We are seeing demand among our customers in Asia for application-specific inspection capability in the ‘sweet spot’ of our advanced macro tools,” said Scott Balak
, the AXi product manager at Rudolph Technologies.
Balak adds, “With sensitivity down to a half micron, we can see defects that are undetectable with traditional macro tools. At the same time, the AXi System is faster and much less expensive than a micro inspection tool. For example, Rudolph recently installed an AXi 935 System for copper CMP inspection at a major Taiwan foundry because it could detect scratches and slurry defects that the customer’s existing macro tools were consistently missing.”
Announced just one year ago, the AXi 935 Advanced Macro Defect Inspection System provides the base (frontside) platform for Rudolph’s all-surface inspection technology, which, when configured with edge and backside inspection modules, can detect and correlate defects on all surfaces of the wafer. Rudolph's automatic defect classification, defect review, and yield management software helps manufacturers use the inspection data to reduce manufacturing costs and accelerate time to market.
Please visit Rudolph Technologies in booth 262 during SEMICON Taiwan to see a live demo of all-surface inspection, and to learn more about Rudolph’s metrology, macro defect inspection, and software products.
