Roadmap and Challenges for Surface Preparation
表面预处理技术的蓝图及挑战
Jeffery W. Butterbaugh，Chief Technologist，FSI International, Inc.
· 过去，表面预处理受到污染物移除的限制；今天在不断创新以缩放比例的制造环境中，表面预处理在器件结构和性能上扮演更为重要的角色。
· 湿法处理的要求：更高的选择比、刻蚀均匀性和刻蚀精度。
· 结技术发展需要新的湿法刻蚀化学试剂
· 结合新材料和新结构来达到芯片尺寸等比缩小，集成这些新材料和新结构需要先进的湿法处理技术和表面预处理能力。
Jeffery W. Butterbaugh，Chief Technologist，FSI International, Inc.
Biography：Dr. Jeffery W. Butterbaugh is Chief Technologist for FSI International and serves as c
o-chair of the FEP (Front-End Process) Technology Working Group for the ITRS. He joined FSI in 1993 and has led process development teams for photochemical, anhydrous HF, cryogenic aerosol, immersion and spray acid processing. Prior to joining FSI, Dr. Butterbaugh worked as a process engineer for IBM and also for Seagate Technology. He received his Ph.D in Chemical Engineering from MIT and his B.S. in Chemical Engineering from the University of Minnesota. He holds 8 U.S. Patents and has authored or co-authored over 40 papers on surface conditioning and plasma etching.
Abstract: Over the past few years we have moved from an era of improving integrated circuit performance by simple dimensional scaling into an era of “scaling by innovation”. It has been suggested that 60-70% of performance gains are now achieved through material and design innovations. This higher level of innovation drives many new challenges in the area of surface preparation. In the past, surface preparation challenges were dominated by removal of contaminants such as organic films, native oxide, metallic species, and particles. In today's environment of scaling by innovation, surface preparation plays a more significant role in device formation and performance. In addition to traditional contamination reduction requirements, surface preparation processes must meet other needs such as highly selective thin film removal, low-etch resist strip and precision thi